Coating forming agent for reducing pattern dimension and method of forming fine pattern therewith
2003
It is disclosed an over-coating agent for forming fine
patterns which is applied to cover a substrate having thereon
photoresist patterns and allowed to shrink under heat so that
the spacing between adjacent photoresist patterns is lessened,
with the applied film of the over-coating agent being removed
substantially completely to form or define fine trace patterns,
further characterized by containing either a water-soluble
polymer and an amide group-containing monomer or a
water-soluble polymer which contains at least
(meth)acrylamide as a monomeric component. Also disclosed is
a method of forming fine-line patterns using any one of said
over-coating agents. According to the invention, the thermal
shrinkage of the over-coating agent for forming fine patterns
in the heat treatment can be extensively increased, and one
can obtain fine-line patterns which exhibit good profiles
while satisfying the characteristics required of semiconductor
devices.
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