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ELECTROPLATING OF LEAD ON COPPER FORM TETRAFLUOROBORATE SOLUTIONS WITH ADDITIVES OF 2-BUTYNE-1,4-DIOL AND ITS DERIVATIVES
ELECTROPLATING OF LEAD ON COPPER FORM TETRAFLUOROBORATE SOLUTIONS WITH ADDITIVES OF 2-BUTYNE-1,4-DIOL AND ITS DERIVATIVES
1991
V. D. Kalugin
V. D. Orlov
L. Y. Voronko
Xuong Van Tue
N. S. Opaleva
Keywords:
Electroplating
Copper
Tetrafluoroborate
2-Butyne
Inorganic chemistry
Diol
Chemistry
Polymer chemistry
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