A PCB Packaging Platform Enabling 100+ Gbaud Optoelectronic Device Testing
2021
We present a packaging platform that enables testing of co-packaged electronic and photonic integrated circuits and components, and that is based on a low-cost FR-4 PCB. The platform is capable of high speed electronic and optoelectronic transmitter and receiver assembly testing, and we demonstrate operation above 100 Gbaud.
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