Viscous fluid-supplying device and viscous fluid-supplying method

The present invention makes it possible to stably supply solder by reducing the variation in the amount of solder supplied to an object in a single solder-supplying operation. When using inadequately stirred solder, the amount supplied per single cycle increases as the number of supply cycles increases. To address same, the device is configured so that the gain of a solder supply operation parameter can be input and the parameter is changed gradually with each supply operation. For example, if the device is configured so that with the increase in the number of supply cycles, the movement speed parameter increases by a ratio determined on the basis of the gain and the supply preparation time is shortened by a ratio determined on the basis of the gain, the increase in the amount supplied that is associated with the increase in the number of supply cycles can be limited and the amount supplied per single cycle can be made to be substantially constant.