Thermal measurements of integrated inductors in CMOS technology and simple 1D analytical model of heat conduction

In this study, infrared thermography is used to measure the temperature response of integrated on silicon spiral inductors to a unit step electrical signal used to excite the samples. The measurements are performed with the use of high speed infrared equipment. The thermal impedance is then extracted from the transient temperature response. Finally, an attempt is made to model the thermal network of the spiral inductors based on the experimental measurements. A one-dimensional analytic thermal modelling approach is applied. Simple geometric structures are modelled in order to understand the complexity of the heat flow throughout the volume of the device under test.