Old Web
English
Sign In
Acemap
>
Paper
>
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
2020
Eiji Nakamura
Toyohiro Aoki
Ryota Yamaguchi
Nobuhiro Sekine
Kuniaki Sueoka
Chinami Marushima
Kenichi Yatsugi
Makoto Yada
Takashi Hisada
Keywords:
Soldering
Bumping
Materials science
Metallurgy
Correction
Source
Cite
Save
Machine Reading By IdeaReader
12
References
1
Citations
NaN
KQI
[]