Electroplating baths containing metal salts and related procedures.

An electrodeposition bath, electrodeposition bath comprising a resinous phase dispersed in an aqueous medium, resinous phase comprising: (a) an ionic electrodepositable resin containing active hydrogen and (b) a curing agent having functional groups reactive with the active hydrogens of (a), and (c) at least one metal compound derived from a metal selected from magnesium, strontium, barium and mixtures thereof, being present said compound in an amount ranging from 1 part per million to 10,000 parts per million of total metal provided that not more than about 1000 parts per million are in the form of soluble metal, based on the weight of the electrodeposition bath.