Printed circuit board with net as substrate

The invention discloses a printed circuit board with a net as a substrate, which is named as a net substrate. The net substrate comprises a substrate net, an upper-layer conductive layer, and a middle bonding layer, wherein the substrate net is a metal wire net or a metal board punching net woven in a high density mode; a metal film or a thin printed circuit board or a flexible printed circuit board (FPC) is used for making a needed circuit graph for welding a connection element, places without wiring and without elements on the upper-layer conductive layer are removed, and places where pins of a mounted element or heat sinks need to be directly contacted with the substrate net are perforated; and the middle bonding layer is a prepreg or a high temperature-resisting adhesive, a vacuum thermal lamination process is adopted to laminate the substrate net and the upper-layer conductive layer as a whole, and the pins or the heat sinks, which need to be directly contacted with the substrate net, of the element can be directly welded or bonded by using a thermal conductive adhesive on the substrate net. The printed circuit board with the net as the substrate can be used in fields in need of air circulation and heat dissipation, and has the advantages of good heat dissipation effects, light weight, flexibility, and low cost.