Vertical shape measuring device capable of compensating shaft system errors of wafer

A vertical shape measuring device capable of compensating shaft system errors of a wafer, which comprises a steel frame base, a platform, a support seat, a beam, a shaft system, a wafer bearing table, a contact-type length measuring device, and an optical flat, wherein the platform is arranged on the steel frame base; the support seat is arranged on the platform; the beam is arranged on the support seat; the shaft system comprises an X shaft, a Y shaft, a Z shaft, and a rotating shaft, the X shaft is arranged on the beam, the Y shaft is arranged on the platform and is perpendicular to the X shaft mutually, the Z shaft is fixed on an X shaft movable plate and is perpendicular to the motion direction of the X shaft mutually, the motion direction of the Z shaft is perpendicular to the measuring platform, and the rotating shaft is fixed on a Y shaft movable plate; the wafer bearing table is fixed on the rotating shaft; the contact-type length measuring device is fixed on a Z shaft movable plate; the optical flat is fixed on the beam parallel to the motion direction of the X shaft. The shape measuring device has simple structure, high integrated level, and full functions, and provides a solution for the measuring of wafer shape parameters.