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Deterioration Behavior of Epoxy Resin for Electronics Packaging and Its Adhesive Joint with Ni by Water Absorption
Deterioration Behavior of Epoxy Resin for Electronics Packaging and Its Adhesive Joint with Ni by Water Absorption
2021
Hironao Mitsugi
Riku Suzuki
Ikuo Shohji
Tatsuya Kobayashi
Keywords:
Epoxy
Electronic packaging
Absorption of water
Materials science
Adhesive
Composite material
Joint (geology)
Correction
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