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Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder
Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder
2021
Yukihiko Hirai
Kouki Oomori
Hayato Morofushi
Ikuo Shohji
Keywords:
Tensile testing
Materials science
Soldering
crystal orientation
Ultimate tensile strength
Composite material
Microstructure
Correction
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