Liquid solder resist composition and coating the printed circuit board

Liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing one or more compounds selected from the group consisting of photopolymerizable monomers and photopolymerizable prepolymers, and a photopolymerization initiator, oxidizing containing a titanium. Photopolymerization initiator, a bisacylphosphine oxide photopolymerization initiator, 25 a first alpha-hydroxyalkyl phenone photoinitiator is liquid at ° C., the second is a solid at 25 ° C. alpha- containing a hydroxyalkyl phenone-based photopolymerization initiator.