Effect of reinforced multiwall carbon nanotubes on the damping characteristics of Sn-Ag-Cu lead-free solder

Abstract Sn-3Ag-0.5Cu solder exhibits an internal friction peak, which corresponds to the sliding of the grain boundaries, in the heating internal friction curve. The activation energy of the internal friction peak increases with the number of reinforced multiwall carbon nanotubes (MWCNTs) because the Sn-3Ag-0.5Cu solder has a finer grain size and more abundant sliding grain boundaries after reinforcement with MWCNTs. The activation energy of the high-temperature damping background (HTDB) of the Sn-3Ag-0.5Cu solder decreases after reinforcement with MWCNTs, indicating that MWCNT reinforcement accelerates the dislocation diffusion process and creep process at the HTDB temperature of the Sn-3Ag-0.5Cu solder.