A method of encapsulating an organic electronic device

Discloses a method of encapsulating an organic electronic device, comprising: a pre-production of electronic devices, the back surface of the substrate material of multilayer films deposited; the finished electronic device, the multilayer composite film is deposited on the surface of the organic electronic device. An organic electronic device packaging method of the present invention provides, a method using chip-scale packaging, the packaging process is integrated into the production process of the device, instead of the conventional way to produce devices on a wafer, after cutting the individual packages. The benefits of doing so is to improve efficiency and reduce costs, while the present invention is the innovative use of the organic / inorganic composite multilayer film packaging, may be isolated from water, oxygen, thereby greatly improve the life of an organic electronic device, and can realize a flexible package, the maximum degree of foldable retention organic electronic device, bending performance. Finally, the invention can be achieved below 120 ℃ low temperature film, it reduces thermal damage to the device and the plastic substrate.