Led module device, method for manufacturing same, led package used for led module device, and method for manufacturing same

This LED module device comprises an LED package, a wiring substrate having an opening for mounting the LED package, and a heat dissipation plate affixed to the LED package back surface. The LED package is assembled on the LED package substrate. The LED package substrate is constituted by attaching, using an adhesive, a laminated film formed from a metal foil with a resin onto a metal plate bent into a prescribed shape so as to have a recess for mounting an LED chip and carrying out silver plating that functions as a reflective material on this metal foil. The LED package is constituted by the LED chip being mounted on the LED package substrate thus constituted, and after the implementation of electrical connection wiring, filling in a transparent resin.