Laminate using a temporary adhesive

【Task】 After polishing of the wafer back surface can be easily peeled off, heat resistance, washing removability provides easy temporary adhesive. A As a temporary adhesive that is loaded between the support and on the circuit surface of the wafer, releasably adhered to adhesive layer made of polyorganosiloxanes which cure by a hydrosilylation reaction between (A), from polyorganosiloxanes It made detachably and a bonded separation layer (B), a laminate for processing the opposite side of the wafer back surface of the circuit surface of the wafer, the polyorganosiloxane constituting the separation layer (B) is RRSiO Preparation and separation methods for their stack. Composition for forming the separation layer. .BACKGROUND