Low loss and robust photonic packaging using fusion splicing

2019 
We show a novel photonic packaging method for permanent optical edge coupling between a fiber and chip using fusion splicing. We demonstrate minimum loss of 1.0dB per-facet with 0.6dB penalty over 160nm bandwidth around 1550nm. © 2019 The Author(s)
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    8
    References
    0
    Citations
    NaN
    KQI
    []