Polymer self assembly in semiconductor microelectronics
2006
Integration of polymer self assembly with semiconductor processing enables sub-lithographic patterning of integrated circuit (IC) device elements and offers a non-traditional pathway to performance improvements (Black, 2005). We discuss target applications including surface-roughening for on-chip decoupling capacitors (Black et al., 2004), patterning nanocrystal floating gates for FLASH devices (Guarini et al., 2003), and defining FET channel arrays (Black, 2005)
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
122
References
12
Citations
NaN
KQI