Bond structure with metal nanoparticles and bonding process using metal nanoparticles

A bonding structure with the metal nanoparticles comprises a first element (1) with a metal surface on at least one side, a second member (2) with a metal surface on at least one side, wherein the second element (2) is arranged such that the metal surface of the second member (2) the metal surface of the first element (1) faces, and a bonding material (3), the said first element (1) and the second element (2) Bondet by sinter bonding the metal nanoparticles. At least one of the metal surfaces of the first element (1) and the second element (2) is designed such that it is a rough surface having a surface roughness within the range of 0.5 microns to 2.0 microns.