Wetting and Brazing of Alumina by Sn0.3Ag0.7Cu-Ti Alloy

The wetting behavior of Sn0.3Ag0.7Cu (wt pct) with the addition of Ti on alumina was studied at 1273 K (1000 °C) using the sessile drop method. The wettability of Sn0.3Ag0.7Cu is significantly enhanced with the addition of Ti. Ti accumulates on the interface and reacts with O, producing TiO and yields good wetting. However, wetting is inhibited in high Ti containing droplets as intense Ti-Sn reactions take place. As a result of these competing reactions, the wettability of Sn0.3Ag0.7Cu-2Ti is the best, with the lowest equilibrium contact angle 24.6 deg. Thermodynamic calculations indicate that the value of the final contact angle cos θ varies linearly with Ti fraction in the Ti-Sn reaction-free case. The influence of the Ti-Sn reaction on wetting is quantitatively characterized by the deviation from the theoretical data. The adverse impact of Ti-Sn reaction on wetting increases in intensity with the droplets containing more Ti as the reaction between Ti and Sn becomes more intense and rapid. Alumina/alumina is brazed using different Ti containing Sn0.3Ag0.7Cu-Ti brazing metals at 1273 K (1000 °C) for 25 minutes. Pores are observed in joints prepared with Sn0.3Ag0.7Cu-0.7, 3, and 4Ti because of poor wettability. The highest joints shear strength of 28.6 MPa is obtained with Sn0.3Ag0.7Cu-2Ti.