Production method and the jig of the electronic component device

PROBLEM TO BE SOLVED: To provide a new method of forming an underfill resin on the lower side of an electronic component with high reliability, in a method of manufacturing an electronic component device by using a tip sealing technology of previously forming a sealing resin material, prior to connecting an electronic component to a mounting object. SOLUTION: The method of manufacturing an electronic component device includes the processes of pushing bump electrodes 32 of an electronic component 30 into a mounting object 10, having connecting parts 14 through an uncured sealing resin material 20, and thereby obtaining a laminate member 5, where the bump electrodes 32 are arranged on the connecting parts 14, and the sealing resin material 20 is formed under the electronic component 30; arranging the laminate member 5 and a sheet material 44 on a support plate 42, discharging air inside the tool 40, including the support plate 42 and the sheet material 44 brought into a vacuum condition, and thereby pressing the laminate member 5 with the sheet material 44; and heat-treating the laminate member 5 in the pressed state, thereby obtaining an underfill resin 22 under the electronic component 30 and connecting the bump electrodes 32 of the electronic component 30 to the connecting parts 14 of the mounting object 10. COPYRIGHT: (C)2011,JPO&INPIT