Lapping, polishing and Ultrasonic Machining of quartz mono crystals

Lapping, Polishing and Ultrasonic Machining of quartz mono crystals are investigated in relation to operating conditions such as abrasive particle size, normal stress and crystallographic orientation. Brittle microcracking was the dominant material removal mechanism but secondary mechanisms were also observed. The Grit Size effect observed in material removal rates was explained in terms of the crack density limit. The effect of crystallographic orientation on material removal rates and surface roughness was discussed in relation to fracture toughness and static hardness.