Performance improvement of lead-free electronic sealing glass

To improve the performance of sealing glass for electronic devices,B2O3-ZnO-CaO lead-free electronic sealing glass was prepared by the solid phase sintering method.The effects of the composition of the sealing glass on its performance were studied.The results show that the sealing glass prepared from 45% B2O3,34% ZnO,10% CaO,2% Na2O,3% K2O and 6% other components(mass fraction)is a low-melting lead-free electronic sealing glass with the sealing temperature below 600℃,tk–100 above 300℃,breakdown voltage larger than 23×106 V/mm,linear expansion coefficient smaller than 7.0×10–6 and flexural strength within 117.65～146.57 MPa.