Thickness Measurement by Using Cepstrum Ultrasonic Signal Processing

Ultrasonic thickness measurement is a non-destructive method to measure the local thickness of a solid element, based on the time taken for an ultrasound wave to return to the surface. When an element is very thin, it is difficult to measure thickness with the conventional ultrasonic thickness method. This is because the method measures the time delay by using the peak of a pulse, and the pulses overlap. To solve this problem, we propose a method for measuring thickness by using the power cepstrum and the minimum variance cepstrum. Because the cepstrums processing can divides the ultrasound into an impulse train and transfer function, where the period of the impulse train is the traversal time, the thickness can be measured exactly. To verify the proposed method, we performed experiments with steel and, acrylic plates of variable thickness. The conventional method is not able to estimate the thickness, because of the overlapping pulses. However, the cepstrum ultrasonic signal processing that divides a pulse into an impulse and a transfer function can measure the thickness exactly.