The effect of HF etching on the surface quality and figure of fused silica optics

The effect of deep HF etching on the surface quality and figure of fused silica optics has been investigated systematically. Fused silica samples (100 mm in diameter x 10 mm thick) were manufactured using the conventional grinding and polishing process. These processed samples are etched with different removal depth. Initially, the surface quality of fused silica samples is characterized in terms of surface roughness and surface defects. Many digs not more than 1μm deep are emerged which originates from the micron grinding cracks and crack pits. These digs worsened the surface roughness and frosted the sample. While submillimeter subsurface damage exposed through etching appear as sparkling dots under the high power lamp. The average total length of millimeter scratches on single surfaces is over 200 mm. Not all millimeter scratches could be exposed until removal depth of up to 2 μm. Finally, the surface figure behavior during deep etching has also been figured out. Etching on the edge of the upper surface of samples placed horizontally went faster than on the inside parts. The surface of samples placed vertically assumed a more complicated removal distribution, which can be both explained in terms of "fringe tip effect". For the change of surface figure PV, the initial surface figure feature plays an important role as well as the etching removal distribution.