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Effect of rapid thermal shock cycle on the thermomechanical reliability of 20Sn-80Pb solder bumps
Effect of rapid thermal shock cycle on the thermomechanical reliability of 20Sn-80Pb solder bumps
2021
Shiqi Chen
Guisheng Gan
Qianzhu Xu
Zhaoqi Jiang
Tian Huang
Cong Liu
Peng Ma
Keywords:
Reliability (statistics)
Thermal shock
Mechanical engineering
Materials science
Soldering
Correction
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