An accommodative approach designed in heat dispersion of fine-pitch Chip-On-Film packages for LCD applications

The reliability of Chip-On-Film (COF) packages is fundamentally dependent upon the quality of the thermal performance. The present study commences by performing an experimental investigation to establish the temperature at surface of driver IC within the COF packaging application under electric power conditions. A finite element (FE) model is then constructed to simulate the thermal behavior within the COF packaging application under equivalent power conditions. The validity of the numerical model is confirmed by comparing the simulation results with the experimental temperature measurements. The 2-metal-tape FE model was also developed based on a 1-metal-tape model to study the thermal spreading effect within the various thickness of copper lead. The results obtained from the 2-metal-tape model showed that increased thickness of copper lead can provide more efficiency to reduce the temperature at driver IC as the COF application.