Method for improving reliability of integrated circuit by controlling temperature

2013 
The invention relates to a method for improving the reliability of an integrated circuit by controlling temperature. The method comprises the following steps: one or multiple temperature monitoring units is or are integrated in the integrated circuit; the temperature monitoring units are adopted to monitor the internal temperature change of the integrated circuit in real time; the working frequency of the integrated circuit is regulated according to the obtained internal temperature of the integrated circuit, and the internal temperature of the integrated circuit is enabled to be controlled within a reliable scope. According to the method, the power consumption of the integrated circuit is reduced through adjusting the working frequency of a digital circuit, and the internal temperature of the chip is adjusted, so that the probability of circuit failure caused by temperature is reduced.
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