Investigation of Liquid Cooling for Data Center Server Based on Micro-fluid Technology

As rapid development of cloud computing, Internet of things, and artificial intelligence, the requirement of computing capability is increasing significantly, spurring tremendous evolution and exponentially growth of modern data centre. To address the thermal issue and save energy cost, a liquid cooling solution based on micro-fluid technology has been developed for server to enable high heating power dissipation on board. Experimental test is performed on the server board with both thermal chips being heated up with gradually increased power, and the liquid cooling modules are connected in different ways for characterization. Heat dissipation capability of >150W per chip has been demonstrated. The thermal performance by using the liquid cooling has been investigated and compared. Low cooling energy consumption is needed to achieve stable cooling performance. The developed liquid solution based on micro-fluid technology shows guarantee to enable the potential capability of advanced servers in future data center.