Nickel electroforming with 355 nm UV laser process applied to 4G solidly mounted resonator packaging

This study utilizes 355 nm ultraviolet (UV) laser' micro electroforming process with supercritical fluid to package 4G solidly mounted resonator (SMR) wafer. The diameter of drilling hole was 100–150 μm with the wafer thickness of 550 μm' and the component was packaged by the embedded circuit and through silicon via (TSV) technology. Experiment results show the aspect ratio was around 5 and the sidewall slope was about 2 degrees. Micro-Ni electroforming was used to form the conductive channel' reduced the process time within four hours. This process and analysis technology obtained the minimum package area' increased the intensity' gained the electrical and thermal properties' and was able to pre-judge the impact of the package components before packaging.