New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules

Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functio...