Characterization of the interface between ceramics reinforcement and lead-free solder matrix

Abstract The Sn-3.0Ag-0.5Cu (SAC305) composite solder reinforced micro-sized silicon carbide and nickel-coated silicon carbide (Ni-SiC) particles were produced by a high-energy ball milling process. SiC and Ni-SiC were homogeneously mixed into SAC305 lead-free solder alloy with distinctive (0.5, 1.0, and 1.5 wt.%) percent weight, through a powder metallurgy path. The growth of nickel on ceramic SiC (1-3 μm) particles was investigated by the electroless nickel (EN) method. The relative contact perimeter (RCP) and the wettability of SAC305 composite solder were investigated with the an image analysis software. The data from image analysis software shows that the relative contact perimeter, as well as the wettability of lead-free composite solders, were significantly improved.