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Effect of Underfill and Cornerfill on the 3-Point Bending Reliabilityof BGA Package Under Thermal Shock Test
Effect of Underfill and Cornerfill on the 3-Point Bending Reliabilityof BGA Package Under Thermal Shock Test
2020
Kyung-Yeol Kim
Haksan Jeong
Sang-Woo Kim
Jae-Oh Bang
Seung-Boo Jung
Keywords:
3 point bending
Thermal shock
Flip chip
effect of
Ball grid array
Composite material
Materials science
Three point flexural test
Correction
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