Hybrid III-V on silicon lasers for photonic integrated circuits on silicon

Silicon photonics is attracting large attention due to the promise of fabricating low-cost, compact circuits that integrate photonic and microelectronic elements. It can address a wide range of applications from short distance data communication to long haul optical transmission. Today, practical Si-based light sources are still missing, despite the recent demonstration of an optically pumped germanium laser. This situation has driven research to the heterogeneous integration of III-V semiconductors on silicon through wafer bonding techniques. This paper reports on recent advances on integrated hybrid InP/SOI lasers and transmitters using a wafer bonding technique made in particular at III-V Lab, France.