High Performance Cooling Solution for Highly Integrated RF-PCBs

Jens Leis,Thomas Ebert,Marta Martinez-Vazquez,Rens Baggen

High Performance Cooling Solution for Highly Integrated RF-PCBs

2021

Jens Leis
Thomas Ebert
Marta Martinez-Vazquez
Rens Baggen

This paper presents an innovative solution for the thermal management of an RF printed circuit board, by integrating a customised liquid cooler into a standard multilayer stackup.

Keywords:

Communications satellite
Computer science
Electrical engineering
Radio frequency
Printed circuit board
Thermal management of electronic devices and systems

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