Application of 3, 6-dioxa-1, 8-octanediamine tetraacetic acid derivative and OSP processing liquid

2017 
The invention relates to an application of a compound with a structure as shown in the formula I in an OSP processing liquid of a printed circuit board. The OSP processing liquid adopts the compound with the structure as shown in the formula I, so that the film thickness on a gold surface can be remarkably reduced, and copper gold selectivity of the OSP is improved; and meanwhile, the high temperature resistance and tinning rate of the OSP film of a PCB test board can be improved, the weldability of the PCB is improved, and the processing capacity of the OSP technology is effectively improved.
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