Multilayer glass–ceramic composites for microelectronics: processing and properties

This chapter discusses material issues and processing defects in a glass-ceramic composite multilayer system fabricated by low-temperature co-fired ceramic technology. The layers were punched for via hole interconnection before several designs were printed using the screen-printing technique. The layers were dried, stacked, laminated under pressure and fired. There were defects and material issues such as warpage, cracks inside a via and delamination. There were other typical processing defects such as overfilled and underfilled via holes, uneven surface microstructure and deformation of the lines. The performance of a laminated composite material depends on the raw materials, processing, technical skill and handling procedures. Knowledge of these is required to minimize defects and issues when making low-temperature co-fired ceramic (LTCC) multilayers.