Effect of static magnetic field on mold corrosion of printed circuit boards

Abstract Mold has a strong impact on the corrosion behavior of metals, especially under environmental conditions conducive to mold growth. However, the magnetic fields generated by electronic devices have effects on the metal corrosion and mold growth. In this study, a 10 mT static magnetic field (SMF) perpendicular to the surface of samples was applied to study the corrosion of a copper-clad printed circuit board (PCB-Cu) by mold under the SMF. Based on the analysis of the corrosion morphology of the PCB-Cu after a test in the atmosphere and the composition of the corrosion products, the corrosion behavior of mold on the PCB-Cu in the presence or absence of the SMF was revealed. In the absence of a magnetic field, mold formed a spore-centered corrosion pit group on the surface of the PCB-Cu, which was macroscopically characterized by regional uniform corrosion. When a 10 mT SMF was applied, the magnetic field exhibited an inhibitory effect on the growth of mold, which was hindered, and the corrosion of the PCB-Cu surface slowed down.