thereof reusable carrier wafer and methods for preparing

Carrier wafer (10) for mounting on a process wafer by means of a bonding layer, wherein the support wafer (10) having a first major surface (12) and a second opposed major surface (14), having the following features: a plurality of trenches (16) in the first main surface (12) and a plurality of trenches (18) in the second main surface (14) of the wafer, wherein the trenches (16) in the first main surface (12) and the trenches (18) in the second main surface (14) angularly offset from each other and having such a depth (d1, d2) are formed, that in intersecting portions (20) of the trenches ( 16, 18) the wafer penetrating openings (22) are formed, characterized, in that the trenches (16) in the first main surface (12) and the trenches (18) in the second main surface (14) by means of a sawing operation, angularly offset to each other are formed.