Progress in transfer of wafer level packaging to panel format
2017
Next generation technologies require new solutions for the packaging industry as Fan-Out Wafer Level Packaging (FO-WLP) moves to the Panel Format. Redistribution layers (RDL) for next generation need fine line features of sub 5 pm lines and spaces without significant yield loss, and tall copper pillar (>100 pm) plating is requested without increasing the plating time. This simple and straight forward requirement is the providing challenges to the equipment & chemical suppliers in Fan-Out plating technology.
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