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Packaging Technology for High-Speed Multichip Modules with a Copper-Polyimide Thin-Film Multilayer Substrate
Packaging Technology for High-Speed Multichip Modules with a Copper-Polyimide Thin-Film Multilayer Substrate
1995
Satoru Yamaguchi
Hisashi Tomimuro
Yukiharu Ohno
S. Hino
Keywords:
Polyimide
Optoelectronics
Packaging engineering
Copper
Thin film
Substrate (chemistry)
Materials science
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