Ceramic substrate body and process for its preparation

Ceramic substrate body, in particular plate-shaped ceramic substrate body for an electronic circuit comprising a ceramic substrate having at least one recess into which an insert body is inserted, wherein the insert body (12) with the substrate (10) via a foam (13) and above in the recess (11) is fixed, wherein the foam (13) is an electrically conductive foam, characterized in that protrudes the insert body (12) through the thickness of the substrate (10).