MG filled polyurethane modified epoxy resin embedding material and preparation thereof

The invention relates to polyurethane modified epoxy resin encapsulating material filled with MG and the preparation method, in particular to epoxy resin encapsulating material prepared by adopting the TDE-85 epoxy resin modified by polyurethane and glass fiber powder (MG) and the method thereof. According to the weight parts, by mixing and reacting the polyurethane, the TDE-85 epoxy resin base material, the MG, the curing agent and other auxiliary agents, the mixture is perfused into a die after the vacuum defoamation is performed, and through heating up, solidifying and demolding the die, the polyurethane modified epoxy resin encapsulating material filled with MG is obtained. The epoxy resin encapsulating material has good mechanical property, heat-resistant performance and anti-high and low temperature impacting property, and is suitable for the encapsulating of the electrical element with wider operating temperature range.