Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking

In 3D integrated circuits, substrate coupling effects due to propagation of High Frequency (HF) parasitic signals are carried by Through Silicon Vias (TSV). These electrical coupling leads to several impacts on performance of 3D circuits. In this paper, predictive HF electrical simulations are achieved by full wave analysis in order to make obvious the coupling effect due to TSVs presence. Solutions to reduce substrate coupling are proposed and discussed.