language-icon Old Web
English
Sign In

Control device probing

2008 
control device (3) comprising a frame (30) having an outer support member supporting a circuit layer 40 and a central support member (35) supporting an assembly (50) of control points. When the controller descends to touch the circuit layer 40 of the control device (30) as peaks from the upper side, the outer frame member of the support (30) is subjected to the stresses induced by the downward movement. When the control points (53) of the carrier pins (51) down touching the electronic components of an integrated circuit board to be tested, the central support member (35) of the frame (30) undergoes the reaction force exerted the integrated circuit wafer.
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    0
    References
    0
    Citations
    NaN
    KQI
    []