QLED packaging device

The invention provides a QLED packaging device. The QLED packaging device comprises a substrate, a chip, a fluorescent wafer and a quantum dot doped packaging material, all of which are stacked on each other orderly; the fluorescent wafer is formed by use of an eutectic alloy having the chemical formula (Y0.99-XcE0.01Gdx)3Al5O12-Al2O3, wherein the numeric area of x is from 0.1 to 0.4. Due to the introduction of the eutectic alloy having the chemical formula (Y0.99-XcE0.01Gdx)3Al5O12-Al2O3, the QLED packaging device has an excellent color rendering property as a luminescent device, and the color rendering index is above 90.