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Optical Imaging Based Detection of Solder Paste in Printed Circuit Board Jet-Printing Inspection
Optical Imaging Based Detection of Solder Paste in Printed Circuit Board Jet-Printing Inspection
2015
D. Heinemann
S. Schramm
S. Knabner
D. Baumgarten
Keywords:
Optical imaging
Electronic engineering
Solder paste
Printed circuit board
Embedded system
Materials science
Optoelectronics
Correction
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