Light emitting device, method of fabricating the light emitting device and light emitting device package

PURPOSE: A light emitting device, a manufacturing method thereof, and a light emitting device package are provided to form a protection member on a side of a light emitting structure, thereby preventing a light emitting structure from electrically short-circuited with an external electrode. CONSTITUTION: An ohmic layer(157) is formed on a light transmissive substrate(110). A light emitting structure(145) is formed on the ohmic layer. The light emitting structure comprises the first conductive semiconductor layer(130), the second conductive semiconductor layer(150), and an active layer(140). A base electrode(132) is formed on the bottom of the light transmissive substrate. A conductive via(131) is connected to the ohmic layer through the light transmissive substrate.