Image sensor having 3 dimension structure and manufacture method thereof

PURPOSE: An image sensor having 3D structure and a manufacture method thereof are provided to maintain contact resistance uniform by forming the contact area between pixels to be uniform. CONSTITUTION: In a image sensor having 3D structure and a manufacture method thereof, a first wafer(310) comprises an optical integration unit(311), a transmission transistor(312), and a first bonding pad. The first bonding pad interlinks one terminal of the transmission transistor to the outside. A second wafer(320) comprises a driver circuit(322) and a second bonding pad(323). The driver circuit processes a signal transmitted from the transmission transistor and outputs it. The first bonding and the second bonding are different size.