A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators

This paper presents a miniature timing microsystem based on a pair of wafer-level packaged co-integrated low and high frequency silicon resonators −430kHz and 26MHz respectively- so as to implement a μW-level accurate, low power, temperature-compensated real time clock (RTC) and to generate low noise, low jitter clocks at any frequency between 1–50MHz in a reconfigurable way at less than 10mW power dissipation. Singulated resonator dies were assembled on a CMOS wafer by thermo-compressive bonding on Au stud-bumps and the resulting system was characterized at wafer level.